MediaTek Dimensity 8200 Officially Launched - Flagship SoC

MediaTek Dimensity 8200 SoC Officially Launched - Flagship Level Processer for Cheaper Phones

iQOO recently confirmed that its upcoming Neo 7 SE will be powered by the upcoming MediaTek Dimensity 8200 SoC. The SoC will support a 6.78-inch Full HD+ AMOLED display and a 5,000mAh battery. This will make the iQOO Neo 7 SE the first phone to be powered by the new SoC. The chip is expected to score 900,000-1,000,000 points in AnTuTu benchmarks, but it isn't guaranteed.

The first phones powered by the Dimensity 8200 are expected to launch in December. It isn't clear whether this will be a worldwide roll-out or just Europe and Asia. However, Redmi is rumored to release a smartphone with the new SoC soon. It is also possible that Xiaomi will follow suit.

The MediaTek Dimensity 8200 is said to feature a tri-cluster design, meaning that it has a prime core running at 3.0GHz, followed by three other A78 cores at 3GHz. The CPU will be paired with the Mali-G610 MC6 GPU, which supports FHD+ displays at 180Hz. It will also feature a 5G modem and Bluetooth 5.3 with LE Audio. The SoC is expected to support 3CC carrier aggregation. It is also said that the chipset is built on a 4nm process. This allows for a higher level of efficiency and power. It will also improve performance and decrease latency. It will be able to offer flagship level experiences.


The Dimensity 8200 will use a 4nm process, which will result in a boost in the speed and frequency of the processor. The TSMC 4nm node will enable the chip to run at a peak speed of 3.1GHz. The CPU will be accompanied by a 140GMACs DSP that runs at 624MHz. The chip will also support 4K 60Hz video capture, dual exposure HDR videography, and up to 320MP primary camera setups. It is also said that the SoC will be capable of achieving a full HD+ display at 180Hz and a 120Hz WQHD+ display.

The SoC will be based on the ARM Cortex-A78 and A55 architecture, but will be optimized for gaming. The chip will also use MediaTek HyperEngine 2.0, which optimizes the entire device for gaming. This will make the smartphone more responsive and offer an enhanced picture quality. It will also support a 120W cable flash charging system. It is also expected that the SoC will offer better multi-core performance than its predecessor. It will also be able to offer hardware-based ray tracing. It has also been speculated that the Dimensity 9200 will support mmWave 5G.

The new SoC is expected to support a tri-band Wi-Fi 6E, 3CC carrier aggregation, and Bluetooth 5.3 with LE Audio. It will be paired with the MediaTek APU 580, which is used for AI processing. This processor is also designed for a pixel density of 320 megapixels and will feature a 14-bit HDR ISP. It will also have a 720p HD camera and a dual-LED flash. It will be available in the Global market in December of 2022.

Chandeshawar Singh

Chandeshawar Singh is a Blogger with more than 10+ years of experience in Tech Blogging

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